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update mask for RDL to not apply polyimide on test tiles

Open jeffdi opened this issue 2 years ago • 3 comments

jeffdi avatar Jan 16 '23 17:01 jeffdi

What is the point of this issue?

RTimothyEdwards avatar Jan 16 '23 19:01 RTimothyEdwards

Tim A wants test tiles from the Open MPW shuttles without polyimide. It is interfering with the processing he is doing with them.

-- Jeff

On Mon, Jan 16, 2023 at 11:57 AM R. Timothy Edwards < @.***> wrote:

What is the point of this issue?

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jeffdi avatar Jan 16 '23 20:01 jeffdi

If Tim Ansell is paying for another RDL mask set, there are additional changes I would like to make, mainly to add more power and ground pads, and additional pad locations which could be used for future revisions; these would not change the bump bonding but should be carried up to the RDL level. (If we can change the bump bonding arrangement, I would add another column of solder bumps and increase the number of available user GPIO pads.)

RTimothyEdwards avatar Jan 16 '23 21:01 RTimothyEdwards