bms-c1
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Thermal Performance Tests
Introduction:
Our aim was to conduct a thermal investigation of the BMS to determine how hot it gets at a current of 100 A or more.
Test Setup:
The picture below illustrates the BMS setup during the testing phase (with heatsink). The tests were performed without actual battery, as described here.
Used Devices:
- Power source: E/A Power Supply PSB 10750-120
- Sink: Deutronic xxx
- Temperature measurements: "TIM QVGA/HD" thermal imaging camera
- Linux & Windows Computer
Boundary Conditions:
- Ambient Temperature: ~24°C
Test Scenarios:
Three different scenarios were tested:
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Without Heatsink:
- Current: 100 A
- Measured Temperature: ~91°C after 35 minutes
- BMS Position: horizontally on the table
- The thermal camera image below displays the temperature distribution upon concluding the test, highlighting the MOSFETs as the area of highest temperature.
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With Heatsink (1):
- Current: 100 A
- Measured Temperature: ~49°C after 25 minutes
- BMS Position: 5 cm above the table (floating, cooling fins facing down to the table)
- The thermal camera image below displays the temperature distribution upon concluding the test, with the PCB layer of the shunt being the hottest area.
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With Heatsink (2):
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Current: 122 A
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Measured Temperature: ~66°C after 4 hours
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BMS Position: identical to Measurement 2
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The thermal camera image below displays the temperature distribution upon concluding the test, with the PCB layer of the shunt being the hottest area.
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Below graph shows the current profile, temperature rise of the internal sensors and thermal camera temperature areas over time (area 2: small rectangle, area 3: big rectangle).
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Conclusion
The BMS can comfortably manage over 100 A while maintaining a temperature within an acceptable range. If feasible, the PCB layer should have a thickness greater than 70 µm to minimize the heating around the shunt. Further work could involve identifying the maximum current that results in a temperature of around 80°C.