Correct SOT-143

[perigoso]

Corrected footprint dimensions for standard SMD instead of wave soldering.

Related to #2381 .

Datasheets for this package:

• onsemi: https://www.onsemi.com/pub/Collateral/318A.PDF
• diodes: https://www.diodes.com/assets/Package-Files/SOT143.pdf
• nxp/nexperia: https://assets.nexperia.com/documents/package-information/SOT143B.pdf

The 3D model seems to not be correct according to the datasheets.

Before:

After:

The same applies to the _Reversed and _Reversed_Handsolder footprints

[cpresser]

I assumed you used the diodes datasheet? I checked against that one.

• [x] Pad numbering and Position is good.
• [x] F.Fab is good
• [x] Courtyard is good
• [ ] Please add a datasheet link into the description
• [ ] Silkscreen should move outwards a little. It should not overlap the F.Fab line. Like so
• [ ] The reverse part should be rotated so that pin1 is in the upper-left quadrant
• [ ] I am unsure how to check the handsoldering parts. Is there any rule you applied to elongate the pads?

[perigoso]

I assumed you used the diodes datasheet? I checked against that one.

I don't remember which datasheet i ended up using as a guideline, but i believe i checked them all against each other and they were the same or very close to the same dimensions (if I'm remembering correctly) so it shouldn't matter too much.

Please add a datasheet link into the description

done. I added NXP's references because they had a both the normal SOT-143 and the reverse pinning version and so it is more consistent.

Silkscreen should move outwards a little. It should not overlap the F.Fab line. Like so

done.

The reverse part should be rotated so that pin1 is in the upper-left quadrant

done.

I am unsure how to check the handsoldering parts. Is there any rule you applied to elongate the pads?

I looked for guidelines, but since i didn't find any i just did what felt right to me, the pins are slightly shorter than the original hand-solder versions