environmental-footprint-data
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Add manufacturing breakdown details
Most PCF files provides breakdown details for the manufacturing part. They are, however, not always fully consistent on the partitioning. Here is the list I ended up on ecodiag's side:
- packaging (PAIA)
- chassis (PAIA desktop+laptops, a very very few HP monitors -> their mistake ?)
- mainboard (PAIA+HPE)
- daughterboard (HPE)
- power supply unit (PAIA)
- HDD (PAIA)
- SSD (PAIA+HPE)
- optical drive (PAIA)
- display (PAIA laptops & AiO, but also a very few HP monitors -> their mistake ?)
- battery (PAIA)
- housing (PAIA monitors)
- electronics (PAIA monitors + wise-thin-client)
- panel (PAIA monitors)
- assembly (Dell wise-thin-client, a very few HP laptops, many Lenovo laptops, HPE)
- materials (Dell wise-thin-client, a very few HP laptops)
- LCD assembly (1 dell + 2 HP laptops)
- PWBs (2 HP laptops)
- Integrated circuits (1 dell + 3 HP laptops)
- chassis+PSU (HPE)
- others (various HP)
This long list is conservative, but that's a lot ! So maybe some components could be merged together ?
For instance, when the PSU is combined with the chassis, maybe we could just put it to "others" since this does not provide much information.
Some other propositions:
- Merge housing and chassis (their use is exclusive)
- Merge display and panel (their use is exclusive)
- Merge mainboard, daughterboard, IC and PWB within electronics ?
After a short discussion, the initial idea would be to retain the most relevant parts only, and accumulate the rest to "others".
At this time we have the following parts in the data model:
- gwp_mainboard_ratio
- gwp_daughterboard_ratio
- gwp_psu_ratio
- gwp_battery_ratio
- gwp_hdd_ratio
- gwp_ssd_ratio
- gwp_opticaldrive_ratio
- gwp_display_ratio
- gwp_packaging_ratio
- gwp_electronics_ratio
- gwp_othercomponents_ratio
- gwp_enclosure_ratio
I suggest to keep :
- gwp_electronics_ratio including :
- gwp_mainboard_ratio (including cpu and ram)
- gwp_daughterboard_ratio
- gwp_hdd_ratio
- gwp_ssd_ratio
- gwp_display_ratio
- gwp_battery_ratio
- gwp_othercomponents_ratio including all others components (enclosure, psu, opticaldrive & packaging)
I made the following changes to resolve this issue :
- Change data model to match my suggestion above
- Modify HPE parser (only one to parse manufacturing breakdown ratios)
@ggael could you modify piechart_analyser.py on the same way?